| 持股明細(資料日期：2026/03/31) |
| 持股名稱 | 比例 |
| US TREASURY BONDS 5.25% 15NOV2028 | 2.78% |
| 台積電 | 2.76% |
| US TREASURY 4.625% 15SEP2026 | 2.70% |
| FRANCE (GOVT OF) 1.75% 25JUN2039 | 2.58% |
| ITALY (REP OF) 1.25% 1DEC2026 | 2.36% |
| BONOS Y OBLIG DEL ESTADO (REG S) 1.5% 30APR2027 | 2.35% |
| MEXICAN BONOS DESARROL 7.5% 03JUN2027 | 2.29% |
| US TREASURY N/B 4.000000 % 31JUL2032 | 2.26% |
| ITALY (REP OF) (REG S) 3.25% 01MAR2038 | 2.21% |
| POLAND GOVERNMENT BOND SER 0727 2.5% 25JUL2027 | 2.17% |
| JAPAN (GOVT OF) SER 113 2.1% 20SEP2029 | 2.12% |
| BUNDESCHATZANWEISINGEN (REG S) (BR) 1.7% 15AUG2 | 1.97% |
| INDONESIA (REP OF) SER FR56 8.375PCT 15/09/2026 | 1.93% |
| MALAYSIAN (GOVT OF) SER 0311 4.392PCT 15/04/2026 | 1.82% |
| SK HYNIX INC | 1.62% |
| US TREASURY BOND 2.75% 15NOV2042 | 1.57% |
| CHINA (GOVT OF) (REG S) (BR) 3.6% 27JUN2028 | 1.57% |
| SAMSUNG ELECTRONICS CO LTD | 1.56% |
| US TREASURY N/B 3% 15MAY2045 | 1.45% |
| US TREASURY N/B 4.000000 % 30APR2032 | 1.44% |
| U.S. TREASURY BONDS 5.5PCT DUE 15AUG2028 | 1.42% |
| TENCENT HLDGS LTD | 1.28% |
| CHINA GOVERNMENT BOND (BR) (REG S) 4.15% 04DEC2 | 1.25% |
| REPUBLIC OF KOREA (REG) 2.75% 19JAN2027 | 1.23% |
| UK (GOVT OF) (REGS) (REG) 3.75% 22JUL2052 | 1.20% |
| US TREASURY NOTE/BOND 1.5% 15FEB2030 | 1.13% |
| THAILAND GOVERNMENT BOND 2.875% 17DEC2028 | 1.04% |
| JAPAN (2 YEAR ISSUE) SER 467 .600000 % 01DEC2026 | 1.04% |
| U S TREASURY 6.625% BONDS 15FEB27 | 1.02% |